Patents and patent applications

2009
D. Lorenzen, D. Schröder, S. Berg:
Conversion unit comprising a plurality of conversion modules and an optical arrangement having such a conversion unit
DE 20 2009 009 203 U1; DE 10 2009 016 953 A1		 FOR SALE
(POLY-02)
2008
D. Lorenzen:
Heat dissipation module
DE 10 2008 051 081 A1		 FOR SALE
(POLY-03)
D. Lorenzen:
Heat dissipation module
DE 10 2008 049 084 A1; WO 2010 015 352 A2
D. Lorenzen, M. Schröder:
Heat dissipation module having a semiconductor element and production method for such a heat dissipation module
DE 10 2008 036 439 A1; WO 2010 015 352 A2
J. Wolf, D. Lorenzen:
Device for detection of power of light of at least one light beam, especially of a laser beam, and laser module with such a device
DE 10 2008 035 829 A1
M. Schröder, U. Röllig, D. Lorenzen:
Heat transfer device comprising a semiconductor component and connecting device for the operation thereof
DE 10 2008 027 468 A1; WO 2009 146 695 A2
D. Lorenzen:
Apparatus with a semiconductor component-array and a cooling element
DE 10 2009 024 310 A1; WO 2010 020 202 A2
D. Lorenzen:
Cooling element for an electronic component and apparatus comprising an electronic component
DE 10 2008 026 856 A1; WO 2009 146 694 A2
M. Schröder, D. Lorenzen:
Heat transfer device having at least one semiconductor element, particularly a laser or light-emitting diode element, and method for the assembly thereof
DE 10 2008 026 801 A1; WO 2009 146 683 A2
M. Schröder, D. Lorenzen:
Heat transfer device for double-sided cooling of a semiconductor component
DE 10 2008 026 229 A1; WO 2009 143 835 A2
D. Lorenzen:
Heat-dissipation polyvalent heat transfer device for at least one semi-conductor element, and associated testing and operating method
DE 10 2008 010 784 B3		 FOR SALE
(POLY-01)
2007
D. Lorenzen, T. Schubert, E. Neubauer:
Method for the production of a composite material, composite material, and composite material product
DE 10 2007 051 570 A1; WO 2009 048 799 A1
D. Lorenzen:
Cooling device for semiconductor elements, semiconductor cooling arrangement and method for producing the same
DE 10 2007 051 796 A1; WO 2009 052 814 A2
D. Lorenzen:
Corrosion-resistant microchannel heat sink and semiconductor cooling device comprising said microchannel heat sink
DE 10 2007 051 797 B3; WO 2009 052 817 A2
D. Lorenzen:
Microchannel heat sink for cooling semiconductor elements and method for treating the surfaces thereof
DE 10 2007 051 798 B3; WO 2009 052 815 A2
D. Lorenzen:
Substrate for semiconductor elements
DE 10 2007 051 800 A1; WO 2009 052 816 A2
P. Hennig, M. Schröder, D. Lorenzen:
Laser diode bars electrically series-connected on a metal cooling body
WO 2009 048 799 A1
D. Lorenzen:
Method for producing at least one radiation source
WO 2009 036 919 A1
P. Hennig, S. Beyertt, U. Röllig, D. Lorenzen:
Stackable multilayered microchannel heat sink with electrically-insulating intermediate layers
WO 2008 122 281 A1
2006
D. Lorenzen, P. Hennig, M. Schröder, U. Röllig:
Carrier for a vertical arrangement of laser diodes with a stop
WO 2007 082 508 A1
2004
H. G. Hänsel, P. Hennig, G. Bonati, D. Lorenzen:
Diode laser module and method for the production thereof
DE 10 2004 057 454 B4; US 7,483,456 B2
D. Lorenzen:
Diode laser subelement and arrangements with such diode laser subelement (CTE-matched heat spreading multi-layer substrate)
DE 103 61 899 B4; US 7,369,589 B2
W.-J. Denner, J. Wolf, D. Lorenzen:
Capillary evaporator and cooling system
DE 103 01 873 B4
2002
P. Hennig, G. Bonati, U. Röllig, D. Lorenzen:
Semiconductor module
DE 102 29 712 B4; US 6,975,034 B2
2001
D. Lorenzen, U. Röllig:
Diode laser component
DE 101 13 943 B4; US 6,754,244 B2; JP
2000
M. Schröder, H. G. Hänsel, D. Lorenzen:
Method for contacting a high-power diode laser bar and a high-power diode laser bar-contact arrangement of electrical contacts with minor thermal function
EP 1 143 583 B1; US 6,621,839 B1
D. Lorenzen, F. Dorsch:
Mounting substrate and heat sink for high-power diode laser bars
DE 100 11 892 A1 (expired); US 6,535,533 B2
1999
D. Lorenzen, F. X. Daiminger:
Device for cooling diode lasers
DE 100 47 780 A1; US 6,480,514 B1; FR 2 800 208 B1; JP
1998
D. Lorenzen, F. X. Daiminger, F. Dorsch, K. Süß:
Diode laser component and method for producing the same
DE 198 21 544 A1
1996
R. Dohle, S. Heinemann, F. Dorsch, F. X. Daiminger, D. Lorenzen:
High-power diode laser and method for mounting the same
DE 196 44 941 C1; US 7,369,589 B2; FR 2 755 308 B1