| 2009 |
| D. Schröder, E. Werner, M. Schröder, J. Meusel, D. Lorenzen, P. Hennig: Improved laser diode for high-power and high-temperature applications Proc. SPIE 7198-?? |
| 2008 |
| D. Lorenzen, P. Hennig: Passively cooled diode lasers in the cw power range of 120 to 200W Proc. SPIE 6867-0Q |
| U. Strauss, H. König, G. Grönninger, P. Brick, M. Reufer, F. Bugge, G. Ebert, M. Stoiber, J. Biesenbach, D. Lorenzen, P. Hennig: Brilliant high-power laser bars for industrial applications Proc. SPIE 6867-?? |
| 2007 |
| J. Sebastian, H. Schulze, R. Hülsewede, P. Hennig, J. Meusel, M. Schröder, D. Schröder, D. Lorenzen: High-brightness high-power 9xx-nm diode laser bars: developments at Jenoptik Diode Lab Proc. SPIE 6456-0F |
| M. Müller, M. Philippens, G. Grönninger, H. König, J. Moosburger, G. Herrmann, M. Reufer, J. Luft, M. Stoiber, D. Lorenzen: Monolithically stacked high-power diode laser bars in quasi-continuous-wave operation exceeding 500 W Proc. SPIE 6456-1B |
| D. Schröder, J. Meusel, P. Hennig, D. Lorenzen, M. Schröder, R. Hülsewede, J. Sebastian: Increased power of broad-area lasers (808nm/980nm) and applicability to 10-mm bars with up to 1000Watt QCW Proc. SPIE 6456-0N |
| 2006 |
| D. Lorenzen, M. Schröder, J. Meusel, P. Hennig, H. König, M. Philippens, J. Sebastian, R. Hülsewede: Comparative performance studies of indium and gold-tin packaged diode laser bars Proc. SPIE 6104-04 |
| 2005 |
| D. Lorenzen, H. R. Schubach: Determination of packaging-induced stress in opto-electronic devices: A comparison of ESPI with stress-optical polarimetry 12. International User Meeting and Conference, Dantec Dynamics GmbH, Ulm, 12.-13. Okt. 2005 * |
| D. Lorenzen: Packaging von Hochleistungsdiodenlasern Workshop "Optopackaging", Jena, 03.03.2005 * |
| 2004 |
| M. L. Biermann, S. Duran, J. W. Tomm, A. Gerhardt, D. Lorenzen: Dependence on intrinsic strain of packaging-induced strain in quantum-well laser diodes Proc. CLEO 2004 paper CTuP3, may 16 - 21, 2004, San Francisco |
| 2003 |
| D.Lorenzen, P. Hennig: Highly thermally conductive substrates with adjustable CTE for diode laser bar packaging Proc. SPIE 4945, 174-185 |
| G. Bonati, P. Hennig, D. Lorenzen, U. Röllig, J. Schulz-Harder, K. Exel, K. Schmidt, A. Meier: A new heat exchanger concept for high power diode laser systems Proc. SPIE 4947, 270-277 |
| 2002 |
| J. W. Tomm, A. Gerhardt, D. Lorenzen, P. Hennig, H. Roehle: Diode laser testing by taking advantage of its photoelectric properties Proc. SPIE 4648, 9-21 (2002) |
| 2001 |
| D. Lorenzen: ESPI-supported CTE-measurements on highly thermally conductive substrates for high power diode lasers 8. International User Meeting and Conference, Ettemeyer AG, Neu-Ulm, 09.-10. Okt. 2001 * |
| D. Lorenzen: Diode laser bar packaging and cooling with CVD-diamond Proc. Micro System Technologies 2001 Conf., 95-100 (2001) |
| 2000 |
| F. Dorsch, V. Blümel, M. Schröder, D. Lorenzen, P. Hennig, D. Wolff: Fiber Coupled Diode Laser Systems up to 2 kW Output Power Proc. SPIE 3945, 42-49 (2000) |
| D. Lorenzen: Cascaded Micro Channel Cooling of High Power Diode Laser Bars Proc. MICRO.tec 2000 Conf., 595-597 (2000) |
| 1999 |
| J. W. Tomm, R. Müller, A. Bärwolff, T. Elsaesser, A. Gerhardt, J. Donecker, D. Lorenzen, F. X. Daiminger, S. Weiß, M. Hutter, H. Reichl: Spectroscopic measurement of packaging-induced strains in high-power laser diode arrays Proc. CLEO '99, 145-146 CTuK53 (1999) |
| J. W. Tomm, R. Müller, A. Bärwolff, D. Lorenzen: Measurement of mounting-induced strain in high-power laser diode arrays Proc. SPIE 3896, 56-64 (1999) |
| J. W. Tomm, R. Müller, A. Bärwolff, M. Neuner, T. Elsaesser, D. Lorenzen, F. X. Daiminger, A. Gerhardt, J. Donecker: Direct spectroscopic measurement of packaging-induced strains in high-power laser diode arrays Proc. SPIE 3626, 138-147 (1999) |
| K. Unger, D. Lorenzen, D. Müller, F. X. Daiminger: Temperaturregelung an Mikrokanalkühlern am Beispiel von Hochleistungsdiodenlasern 4. Chemnitzer Fachtagung "Mikrosystemtechnik - Mikromechanik & Mikroelektronik", Chemnitz, 11.-12. Okt. 1999 |
| K. Unger, D. Müller, D. Lorenzen, F. X. Daiminger: Controlling diode laser bar temperature by micro channel liquid cooling Proc. SPIE 3825, 80-91 (1999) |
| 1998 |
| D. Lorenzen, J. Bonhaus, W. R. Fahrner, E. Kaulfersch, E. Wörner, P. Koidl, K. Unger, D. Müller, S. Rölke, H. Schmidt, M. Grellmann: Packaging and Microcooling of High Power Diode Laser Bars Proc. 24th Ann. Conf. IEEE Ind. El. Soc. IECON '98, 2342-2347 (1998) |
| F. X. Daiminger, F. Dorsch, D. Lorenzen: High-power laser diodes, laser diode modules, and their applications Proc. SPIE 3682, 13-23 (1998) |
| 1997 |
| J. Bonhaus, D. Lorenzen, E. Kaulfersch, A. Denisenko, A. Zaitsev, A. Kwong, K. Man, H. Reichl, W. R. Fahrner: Optimizing the cooling of high power GaAs-laser diodes by using diamond heat spreaders Proc. Micro Materials '97 Conf., 505-508 (1997) |
| D. Lorenzen, S. Heinemann, J. Bonhaus: Diode laser bar mounting on dielectric heatspreaders Proc. Micro Materials '97 Conf., 513-518 (1997) |
| *) talk without printed publication |