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POLY-03: Lid Cooling A diode laser comprises a heat sink for passive ccoling and opposite to it a microchannel heat sink for alternative or additonal active cooling |
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Claims: 1. A heat-dissipation module with a semiconductor module (2) having a first and an opposite second side (13, 12), a first heat-dissipation body (3) for the conductive cooling of the semiconductor module (2), which has a first contact surface (6), a second heat-dissipation body (4) which has a second contact surface (7) which faces the first contact surface (6) and in which a cooling channel (16) is constructed, through which a cooling fluid can be passed, wherein the semiconductor module (2) is arranged between the two heat-dissipation bodies (3, 4) and the first side (13) is joined to the first contact surface (6) in such a manner and the second side (12) is joined to the second contact surface (7) in such a manner that the first side (13) of the semiconductor module (2) is thermally contacted with the first contact surface (6) and the second side (12) of the semiconductor module (2) is thermally contacted with the second contact surface (7), and wherein, as seen in the top view onto the second side (12) of the semiconductor module (2), the cooling channel (16) in the second heat-dissipation body (4) extends at least in sections in the region of the second side (12), whereas in the first heat-dissipation body (3), as seen in the top view onto the first side (13) of the semiconductor module (2), no channel for conveying a cooling fluid extends in the region of the first side (13). 2. The heat-dissipation module according to Claim 1, in which the first heat-dissipation body (3) does not have a cooling channel for a cooling fluid. 3. The heat-dissipation module according to Claim 1 or 2, in which an inlet (21) and/or an outlet (20) of the cooling channel (16) runs through the first heat-dissipation body (3) . 4. The heat-dissipation module according to any one of the previous claims, in which both heat-dissipation bodies (2, 3) are electrically conductive at least in some areas and the first contact surface (6) is electrically contacted with the first side (13) of the semiconductor module (2) and the second contact surface (7) is electrically contacted with the second side (12) of the semiconductor module (2). 5. The heat-dissipation module according to Claim 4, in which the electrical contacting between the first side (13) and the first contact surface (6) is present in a first section (8) of the first contact surface (6) which has a second section (9) adjacent thereto, the electrical contacting between the second side (12) and the second contact surface (7) is present in a third section (10) of the second contact surface (7) which has a fourth section (11) adjacent thereto, and in which an electrically insulating intermediate layer (5) is provided between the second and fourth sections (9, 11). 6. The heat-dissipation module according to Claim 5, in which the electrically insulating intermediate layer (5) is at least part of a material connection between the second and fourth sections (9, 11). 7. The heat-dissipation module according to any one of the previous claims, in which at least one of the two heat-dissipation bodies (3, 4) has an electrically insulated or non-conductive main body with an electrically conductive layer constructed thereon, whose external side, which faces away from the main body, forms the first or second contact surface (6, 7). 8. The heat-dissipation module according to any one of the previous claims, in which at least one of the two contact surfaces (6, 7) is constructed as a flat surface. 9. The heat-dissipation module according to any one of the previous claims, in which at least one of the two contact surfaces (6, 7) is constructed as a stepped surface. 10. The heat-dissipation module according to any one of the previous claims, in which both joint zones between the semiconductor module (2) and the heat-dissipation bodies (3, 4) and also, in at least one projection of the semiconductor module (2), the first and second contact surfaces (6, 7) lie perpendicularly to their and/or second sides (13, 12) at least in sections. 11. The heat-dissipation module according to any one of the previous claims, in which at least one of the contact surfaces (6, 7) of the heat-dissipation bodies (3, 4) is materially fixed directly to the corresponding first or second side (13, 12) of the semiconductor module (2) by means of at least one electrically conductive joining means. 12. The heat-dissipation module according to any one of the previous claims, in which the heat-dissipation module has a cooling device which is positively fixed to a side of the first heat-dissipation body (3) which faces away from the first contact surface (6). 13. The heat-dissipation module according to any one of the previous claims, in which the second heat-dissipation body (4) has a plurality of micro-cooling channels which, as seen in top view onto the second side (12) of the semiconductor module (2), extend at least in sections in the region of the second side (12). 14. The heat-dissipation module according to any one of the previous claims, in which the semiconductor module is constructed as a semiconductor emitter, particularly as a laser diode element. |
